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Kurtz- Ersa Soldering Systems ASM Meeting Timisoara Production needs us Kurtz- Ersa Soldering Systems ASM Meeting Timisoara Innovations in Selective Soldering Highest Flexibility
Kurtz- Ersa Soldering Systems ASM Meeting Timisoara Production needs us Kurtz- Ersa Soldering Systems ASM Meeting Timisoara Innovations in Selective Soldering Highest Flexibility Throughput Solutions Production needs us Business Segments Electronics Production Equipment - Soldering systems - Soldering tools Metal Components - Castings - Sheet metal - Machining Moulding Machines - Particle foam machines - Foundry machines Who is Ersa? One of the biggest producers of soldering equipment in the world Privately owned by the Kurtz Family Total production in Wertheim (D) Employees Turnover 2013 = 71 Million 219 Selectives sold in Selectives sold in 2014 (and counting) Ersa History Ersa was created 1921 on the Vision of our founder, ERnst SAchs Ersa Technology Leadership reacting to Market needs The industrial Revolution begins for Electronics. 1921: Ernst Sachs invents the first electric soldering iron ERSA H1*. *patented Ersa Technology Leadership reacting to Market needs Wave soldering 1968: finds its place in Ersa brings the modern Wave soldering production line. to Germany *Ersa Wave soldering machine with Fluxer and Drying unit. *patented Production Equipment Stencil Printer Reflow Soldering Systems Selective Soldering Systems Wave Soldering Systems Hand Solder Tools Repair Equipment Inspection Equipment Kurtz- Ersa Soldering Systems ASM Meeting Timisoara Innovations in Selective Soldering Highest Flexibility Throughput Solutions Production needs us Product Range - Selective Soldering Systems Versaflow Ecoselect 2 Multiwave Ecocell Ecoselect 1 Selective Soldering Technologies Advantages single-wave Highest flexibility through programmable x,y,z movement of the wave Individual parameters for every solder joint No prefered direction of soldering No costs for tooling No lead times Advantages multi-wave Shorter cycle times because of simultaneous soldering Process time is independent from the number of solder joints Technology Fluxing Preheat Flexible Soldering Multiwave Soldering Technical Support Technology Fluxing Technology Multidrop-Precision Spray Fluxer play video click button - Precise and exactly defined flux deposition - Minimization of the amount of flux deposited (Diameter of area covered with flux is down to 3 mm) - Minimization of ionic contamination (No Clean Process) - Flux deposition either as single point or as track - Amount of flux deposited for each joint is programmable - Standard Flux Head is 130 µ Options = 180 µ and 270 µ Multidrop-Precision Spray Fluxer - Provision of an alternative flux type to reduce change-over time - Continuous flux level monitoring - Optimized accessibility through simple removal of the flux tanks Multiple Spray Heads - Controls up to 4 spray heads - Increasing rate of throughput by processing multiple-up assemblies - Precise coating of larger areas without time-consuming stopping of the axes Standard Monitoring Function Programable spray stream monitoring to check if there is flux and if the fluxer sprays vertically Fluxer Monitoring Measuring of fluxer amount Droplet counter Technology Preheat Technology The task of the preheating is to Vaporize the fluxes carrier medium Pre-activate the flux / depending on the type Reduce the thermal shock for the components Ensure the reproducibility of the temperature profile Only preheat as much as required, keeping in mind the amount of energy required by the particular assembly Temperature profile for selective soldering Solder time Gradient The gradient has to be observed if ceramic components ore in the immediate vicinity of the solder joint to be made (Temp. shock of ceramic capacitors) Shock The sharp increase in temperature from the preheat level to soldering temperature depends in large parts on the specification of the components. The permissible values are to be taken from the data sheets of the components. In addition, the effect of the temperature on already soldered SMD s close by to the selective soldering joint needs also be observed. The saddle of the profile is determined by the heat required by the assembly. e.g. 2 3 K/s Bottom Preheater - High performance density for effective preheating of the board - Inertia-less Control - Four time windows to control the temperature profiles - Adaptation of the heated length to the format of the assembly - Chronological control depending on the time required for soldering - Max. 3 modules prior to solder module 1 - Post heating cycles after process disruptions - Pyrometer Control as option Preheating Multilayer Boards Telecommunication (24 Layers) T T T +++ If, for multi-layer assemblies, thermal energy is supplied only from one side (lower side), then the heat has to travel, layer by layer, from the bottom up through the board. Since each layer absorbs energy, a temperature gradient exists from bottom to top of the board. Therefore, to achieve a uniform and homogeneous heating of the board, a correspondingly long time has to be accepted. Preheating Multilayer Boards - Telecommunication (24 Layers) T +++ T T +++ If multi-layer boards are supplied with thermal energy from both sides, the heat penetrates the board simultaneously from top and from bottom. As a result, the temperature gradient is very small, and the board warms up uniformly and homogeneously at a much faster rate. At the same time, the stress experienced by the lower side is reduced, and the danger that the flux is damaged during the preheat process is minimized. Top Side Preheater - Combines IR and convection technology - Effectively preheats assemblies requiring large amounts of heat - Suitable for installation in the preheat as well as in the solder module play video click button Technology Flexible (Point) Solder Technology Reflowlöten Configuration - Single Solder Nozzle - Wettable Nozzles - Constant solder flow over the complete nozzle surface no preferred direction for solder to drain - Continuous heat transfer into the solder joint during the solder process - No orientation of the component to the solder nozzle required - No layout constraints for the orientation of the components - Suitable for a wide variety of solder alloys Design of Electro-Magnetic Reflowlöten Solder Pot - Maintenance-free design with electro-magnetic solder pump - No mechanical movable part in the solder bath - Precise wave height due to continuous circulation of solder - Outstanding repeatability of solder process (no impeller) - No adjustment after servicing the solder bath Reflowlöten Monitoring - Solder Bath - Solder wave height is measured - Solder level in bath is monitored / Solder wire feeder option - Solder temperature is exactly controlled - N2 atmosphere assures stabile process conditions Reflowlöten Solder Snap-Off with Wettable Nozzle Surfaces F1= Wetting Force F2= Capillary Force F3= Gravity F4= Adhesive Forces - Solder snap-off, the point in the process when the solder breaks off from the solder joint, is positively assisted by the adhesive force F4, which is generated by the wettable surface of the nozzle. - This adhesive force, in conjunction with gravity F3, enables the solder to properly drain off from the solder joint after having formed it, and to eliminate bridging and shorts. Reflowlöten Advantages when Soldering with Wettable Nozzles Substantial saving in time and reduced thermal stress on the board material through perfect process management - To solder square PGA s, it is sufficient to program the four corner points of the component - Neither the board assembly nor the nozzle needs to be repositioned - The solder nozzle moves without pausing and solders the component without a run-out zone Reflowlöten Solder Snap-Off with Wettable Nozzle Surfaces Standard Snap-Off - forms convex solder joints Controlled Snap-Off - forms concave solder joints Reflowlöten Configuration Solder Module Z - variable Different nozzle geometries Variety of Alloys - Both solder bath can be raised, separately and individually, on the axis up to the required working height (z- direction) - First mode of operation with two identical nozzles but different alloys. - Second mode of operation with two nozzles of different geometries and identical solder. Technology Multiwave (DIP) Solder Technology Simultaneous Dip Soldering with Multiple Nozzles Non wettable surfaces for improved flow characteristics Good stability of the shape of the joints Improved peel off Short cycle times High throughput Summary of needs, requirements and possibilities in order to design a nozzle plate - PCB Layout recommendations - What do we need from our customers - Design procedure - Standard nozzle design and tools - Results of own research - Applications Each nozzle plate is designed individually at Ersa, depending on the customer needs and specifications! What do we need from our customers? Perfect Solution: the Real board The Better Solution: 3D CAD drawing -.stp file A Good Solution: 2D CAD drawing dxf or GERBER files Design procedure at Ersa 1. Customer Data are collected by Steffen Schuetz EPTM 2. Nozzle Dimension Design by Process Technology Team Design procedure at Ersa 3. EPTM Decision - Standard Nozzles or Specific Nozzle Design Specific Nozzle Design Standard Nozzle Catalog Design procedure at Ersa 4. Specific Nozzle Tooling Design in the Design Department Design procedure at Ersa 5. Bill of Material is sent to Purchasing Department 6. Parts are assembled on Production Floor Description of Parts 1. Quick connects for plate removal tool 2. Baffle frame 3. PCB Support pins 4. Solder nozzle 5. Base plate 6. Board stop 7. Coding and center holes 8. Quick locks Ersa Standard Solder Nozzle Design Old Standard Wettable outer nozzle surface Requires continuous maintenance New Standard Non wettable outer nozzle surface Requires much less maintenance Effective Measures against Solder Bridging The use of wettable Combs and Plates inside the nozzles Mainly used with multiple rowed components Stops bridging of solder joints Better peel off for excessive solder Improving Process Management Use of baffle frames for rising the solder level arround the nozzles Better heat transfer Reduction of dross Has to be adapted to the PCB size Active Process Interlock Poka-Yoke Coding Security to build in the right nozzle plate (and hold down system) in the right direction Plausibility check if solder nozzle plate matches with active solder program Center holes RFID Transponder + Reader PCB/Component Hold Down System The PCB and/or the components can be held down by the use of a product specific hold down plate. On this plate there are spring loaded pins, placed at positions where support is needed. PCB/Component Hold Down System How it works Support Pins Carrier + PCB Results of our Ersa research Designing a nozzle plate is not as easy as it seems. There are a lot of different parameters that take influence to the solder quality. Therefore permanent (time consuming) talks between the design and application department is essential. These parameters are: Heat capacity of the component Adjacent components Adjacent nozzles Geometry of the component Geometry of adjacent components Geometry of the nozzles Parts built in the nozzle (Combs, plates, platforms) Drain holes Splashing safety at drillings Keep-out zones Results of our own research Bachelor Thesis of Ulrich Dosch Tests with different positions and diameters of the drains Tests with hot water and solder Goal: Maximize the heat transfer from the solder wave to the PCB Standard Applications Special Applications Electromagnetic Solder Pumps Mechanical Pump Multiwave solder module Max. solder dimension 370 x 480mm Max. pcb/carrier dimension 380 x 500mm Solder filling (leadfree) appr. 450kg Free space top/bottom +100/-40mm Electromagnetic Pump (+ XL Version) Muliwave Solder Module Max. solder dimension 350 x 380mm (360 x 460) Max. pcb/carrier dimension 350 x 450mm (406 x 500) Solder filling (leadfree) appr. 230 kg (410 Kg) Free space top/bottom +80/-25mm Software ERSAsoft System Reflowlöten Visualization Ersa CAD Assistant 3 Off-line program software Time-saving Fluxer Soldering Auto-Track Keep Out Areas Schematic diagram of soldering - and restricted areas Area of soldering: Restricted area: PCB Layout Recommendations for Designers Solder joint Area of soldering Restricted area for non selective solder joints Area which is wetted by the solder wave. It is possible that the real solder joint might be smaller. The position of the solder joint within the area of soldering could be chosen. If possible a symmetrical/central position should be taken. Within this area there should be no adjacent components which are not going to be selective soldered. Important: Highest priority is the integrity of the restricted areas. If their size is less than specified, adjacent SMT components may be spilled away during the selective soldering process. Layout recommendations for Versaflow Flex - and Multi Wave are available as PDF Kurtz- Ersa Soldering Systems ASM Meeting Timisoara Innovations in Selective Soldering Highest Flexibility Throughput Solutions Production needs us Flexibility in modules Basic System with Mini-Wave Soldering Module and additional Mini-Wave Preheating Soldering Module Module - One Fluxer module can be fitted with up to 4 flux spray heads - Preheater modules can additionally be segmented - Each solder module can be equipped with twin solder baths - With a dual conveyor throughput can be doubled Basic System with Multi-Wave Module and additional Mini-Wave Preheat Module - Fluxer: Precise fluxing of larger areas through application of 4 spray heads - Preheat modules can additionally be segmented - Alternatively available also with second multi-wave bath (no loss in productivity because of product change) Basic System and maximum variation - Highest throughput - Maximum variation Segmented Conveyor System (Dual Lane) Dual Lane - Doubles the through put - Synchronous processing of the board in the respective modules Conveyor System Versaflow with Dual Track Conveyor and additional soldering module VERSAFLOW 3-45 Highspeed Multiwave VERSAFLOW - Options Other Selective Machines Nozzle Solutions Nozzle Solutions NEW: Mini Vario Wave - Selective Soldering machine with a stabile, reproducible wave soldering process - Selective- and wave soldering process in one soldering module possible - Outstanding wettability (75mm) - Controlled movement speed and wave pressure - Ideal pressure distribution due to VARIO- Technology - For selected applications and throughput - Improved solder snap-off through improved flow characteristics Additional Options VF 3-66 (610 x 610mm) machines Camera Control of Soldering Process Automatic Solder Pot Feeders (with colour control) Fiducial Recognition Warpage Control Solutions Automatic Nozzle Activation Fifo Cooling Tower for Ecocell Complete (Closed-loop) conveyor solutions Ersa References (extract) Selective Machine References in Romania Flextronics Timisoara (12) Continental Timisoara (2) AEM Timisoara (4) Leoni Arad (2) Plexus Oradea Celestica Oradea Robert Bosch Cluj (2) Zollner Satu Mare (3) Psi-Control Brasov Miele Brasov A-E Electronics Bacau Connect Group Oradea (In order)... Thank you very much for your attention! We are highly interested in your Challenges Questions????? Mixed PCB Fine-Pitch PCB
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