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SEMICONDUCTOREQUIPMENT http://www.asmpacific.com ASM Semiconductor Equipment Products Index Materials Handling Model 3 AD9212 / AD9210 IS9012TS Materials Handling Process Harrier Xtreme 4 AD8312 AD8312R Wire Bonding Equipment Eagle Xtreme Gold Ball WB Epoxy DA 5 AD838R Epoxy DA AD908 Stud Bumping Equipment AD211 / AD212 Hummingbird Gold / Copper Stud Bumping AL501 Aluminium Wire Wire Bonding AB559A Series Fine Equipment Aluminium Wire AB530 Eutectic DA 7 Materials Han
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  S EMICONDUCTOR E QUIPMENT  IndexASM Semiconductor Equipment Products 1 3  12131415 456789 1011 COE139 /COE139RPC139 /PC139R2R Reflow OvenSnap Curing Oven SR902 / SR902L Strip FormSubstrateStrip / ReelFormSubstrate MaterialsHandling Model Process CuringOven AOI, Map Sorting / Die SortingEquipment 4” Wafer Handling Map Sorting Advanced OpticalInspection (AOI) MS100 Plus Die Sorting  AS899 ThermosonicGold Ball Wire BondUltrasonic WedgeWire Bond TwinEagle Xtreme Harrier XtremeEagle XtremeiHawk XtremeiHawk-VEagle Xtreme X2LiHawk-02Eagle60AP-LDES100 6” Wafer Handling MaterialsHandling Model Process StudBumpingEquipmentWire BondingEquipmentWireBondingEquipment 12” Wafer HandlingGold BallWB Fine  Aluminium Wire Gold / Copper Stud Bumping Hummingbird Heavy  Aluminium Wire  AB530  AL501  AB559A Series MaterialsHandling Model Process 12” Wafer Handling8” Wafer Handling6” Wafer HandlingMisc.  AD9212 / AD9210IS9012TS  ASM GoCu COG900 /COG930FOG900 /FOG930 Flip ChipEpoxy DAEpoxy DAEpoxy DAEutectic DAEutectic DAMulti-Chip DA ACF D/AGlass AttachLens Holder AttachSoft Solder DA IS9012TCIS9012LA AD8312LinDA AD8312RIS8912DA AD838 AD838R AD838L AD838P AD830 / AD830R AD908 AD830U AD830UR AD211 / AD212 AD220SD890A AD100 AD880 AD881 Series AD819-PD AD819-LDMCM12IS898GAIRGA868IS868LA2IS600 Solder Paste DA /Clip Attach eClip DieAttachEquipment 161718 MaterialsHandling Model ProcessMaterialsHandling Model Process Dispensing/  JettingSystemMoldingEquipment Strip FormSubstrateStrip FormSubstrateStrip FormSubstrateStrip / Reel Form Substrate Reel FormSubstrate12” Wafer  DS520 / MDS500 Series JettingGlob-top, Dam & FillTransfer MoldingCompression Molding IDEALcompress™OSPREYIDEALmold™80/120/170tIDEALmold™R2RIDEALab™IDEALab™-WLPWLP300 Strip FormSubstrate MaterialsHandling Model Process  IndexASM Semiconductor Equipment Products 2 181920 SD Card MaterialsHandling Model ProcessMaterialsHandling Model Process SOT, SOD,QFN, DFN& etc. MP-TAB Discrete PackageSD Card Singulation MP-SDS Trim/Form/SingulationSystem 22 SMD LED Testing andSorting MaterialsHandling Model Process LED (SMD) Sorting &TapingSystemTesting System SMD type Chip LED, Top LED & Sideview LEDSMD LED Taping SLS230 / SSLS230T Plus High Power LEDTesting & Sorting IP360 Series MeasuringElectrical /Optical Characteristics for Die / PackageLED Tester  TLB203SLT400 Complete QualityInspection Handler Singulation and Finishing Integrated System MaterialsHandling Model Process TSSOP, QFN / MLP, MBGA, etc.M-CAN, S-CAN, SOP, TSOP, TSSOP & etc. FT2030 Turret Based Test Handler TO220, TO3P, TO264, DPAK, etc.SC59, SC70, SOT23, SOT89, SOT113, SOT223, SOIC, TSSOP, QFN/MLP, MBGA, DPAK, TO220, TO3P, TO264, SIP9, etc. FT-Power  SC59, SC70, SOT23, SOD923, SOT113, SOT223, etc. FT2018FV2030FET-CLUSTER Laser Mark HandlingEquipment  All kinds of IC and Power DeviceMatrix Leadframes LS1000 Laser Mark Handler Carrier Based TestHot Test Test andFinishHandlingEquipment M-BGA, QFN,SOIC, QFP, TSOP, etc.SO, TSOP, QFN, MLF, BCC, BGA, CSP, etc. FT1000FT1000-HD 21 MaterialsHandling Model Process Ball Placement and CSP HandlingEquipment Ball Placement BP2000 CSBGA / PBGA, flex BGA & etc.High Speed TapeSorting CS900 BCC, CSBGA,MLP, QFN, SiP & etc.DPAK, D²PAK, TO220, QFN, DFN, SOP,TQFP, TSOP, TSSOP & etc. MP209 Mechanical PressTrim / Form  12” Flip Chip Bonding Equipment *Remark: All performance is package dependent Thermosonic Flip Chip Bonder (for Image Sensor Application) IS9012TS  Applications:  Thermosonic flip chip bonding on SBGA, BGA, ceramic panels, singulated units on carrier, lead frames, etc.    High precision thermosonic flip chip bonding process    Excellent foreign material control for image sensor application  ã HEPA fan filter unit providing clean air flow  ã Blow & suck cleaning for housing wafer  ã And more……    Large range of die sizes handling    Intelligent self-compensated bond force control    Patented transducer design    Consistent and independent heating controls    Workholder with rigid clamping system to hold substrate during bonding Dual Head Flip Chip Bonder AD9212 / AD9210  Applications:  Flip chip bonding on SBGA, BGA, ceramic panels, singulated units on carrier, lead frames, etc.    High productivity with individual dual flip chip bonding systems    Extra wide substrate handling    Precise placement with latest linear motorizing systems    Up to 12” wafer handling capability    Supporting flux dipping flip chip process    SMEMA standard compatible    Convertible flip chip and direct die bonding processes (option)    AD9210  ã Up to 210 mm track width handling capability  ã Tape feeder handling capability (option) 3 12” Flip Chip Bonder (for Image Sensor Application) IS9012LA  Applications:  Image sensor flip chip bonding on e.g. CLCC, PLCC, BGA, PCB, singulated units on carrier, etc.    Excellent foreign material control for image sensor application  ã HEPA fan filter unit providing clean air flow  ã Blow & suck cleaning for housing substrate  ã Workholder with clean cell feature  ã And more……    Flexible indexing system for substrate or boat carrier design    Real time epoxy pattern inspection and position alignment    Up to 12” wafer handling capability    Supporting both flip chip and direct die attach processes Thermocompression Flip Chip Bonder (for Image Sensor Application) IS9012TC  Applications:  Thermocompression flip chip bonding on e.g. CLCC, PLCC, BGA, PCB, singulated units on carrier, etc.    Excellent thermocompression (TC) bonding performance    Excellent foreign material control for image sensor application  ã HEPA fan filter unit providing clean air flow  ã Blow & suck cleaning for housing wafer  ã And more……    Flexible indexing system for substrate or boat carrier design    Real time dispensing pattern inspection and position alignment    Up to 12” wafer handling capability    Supporting both flip chip and direct die attach processes (option)
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