DSP 615D (Sn62/Pb36/Ag2) NO CLEAN DISPENSING SOLDER PASTE - PDF

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SN/AG/CU. 862 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN/AG/CU. 862 Rev DSP 615D (Sn62/Pb36/Ag2) NO CLEAN DISPENSING SOLDER PASTE CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison, IL 60101!
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SN/AG/CU. 862 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN/AG/CU. 862 Rev DSP 615D (Sn62/Pb36/Ag2) NO CLEAN DISPENSING SOLDER PASTE CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison, IL 60101! ! FAX EUROPE UK: Unit 9 Apex Ct. Bassendale Rd. Bromborough, Wirral CH62 3RE! ! FAX ASIA-PACIFIC HEADQUARTERS SINGAPORE: 6 Tuas South St. 5 Singapore ! ! FAX PHILIPPINES: Phase 1 Qualitek Ave. Mariveles, Bataan Philippines C-2106! ! FAX CHINA: 3B/F, YiPa Print Bldg. 351 # JiHua Rd., Buji Shenzhen, China ! ! FAX This data is based on information that the manufacturer believed to be reliable and offered in good faith. Qualitek International, Inc. makes no warranties expressed or implied as to its accuracy and assumes no responsibilities and liabilities arising out of its use by others as conditions and methods of use of the products is beyond the control of Qualitek International, Inc. The user must determine the suitability of the product before using it on a commercial basis. The warranties extend only to the conformity of the product to the physical descriptions. In no event will Qualitek International, Inc. be responsible for special, incidental and consequential damages whether the claim is in contract, negligence or otherwise. Qualitek specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. Description Delta Solder Paste 615D is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of Sn62/Pb36/Ag2 DSP 615D are non-conductive, non-corrosive and highly insulated. Main Features Low residues Easily dispensed Excellent wettability Hard non-conductive residues Technical Data Specification Test Method Flux Classification REL0 JSTD-004 Copper Mirror No removal of copper film IPC-TM Corrosion Pass IPC-TM SIR JSTD x ohms IPC-TM Electromigration Pass Bellcore GR-78-CORE Post Reflow Flux Residue 45% TGA Analysis Acid Value 110 IPC-TM Metal Loading 88% IPC-TM Viscosity Brookfield (1), kcps 400+/-10% kcps IPC-TM modified Malcom (2), poise IPC-TM modified Slump Test 25 C, 0.63 vertical/horizontal No bridges all spacings IPC-TM C, 0.63 vertical/horizontal No bridges all spacings IPC-TM C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM Solder Ball Test Pass IPC-TM Tack Initial 105 gm JIS Z 3284 Tack 24 hr 98 gm JIS Z 3284 Tack 72 hr 92 gm JIS Z 3284 Page 2 of 6 Physical Properties Solder Composition Sn62 alloy is the conventional eutectic solder used in most electronic assemblies. The Sn62 alloy conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international standards. Typical Analysis Sn Pb Cu Ag Sb Bi In As Fe Ni Cd Al Zn Au Bal Sn62/Pb36/Ag2 Sn62/Pb36/Ag2 Melting Point, C Yield Strength, psi 3950 Hardness, Brinell 14 HB Total Elongation,% 48 Coefficient of Thermal Expansion 27.0 Joint Shear Strength, at 0.1mm/min 20 C Tensile Strength, psi 4442 Joint Shear Strength, at 0.1mm/min 100 C Density, g/cc 8.50 Creep Strength, N/mm 2 at 0.1mm/min 20 C Electrical Resistivity, (µohmcm) 14.5 Creep Strength, N/mm 2 at 0.1mm/min 20 C Electrical Conductivity, 6.9 Thermal Conductivity, 10 4 /ohm-cm W/m.K Particle Size Sn62 alloy is available in 3(45-25µm) and 4(38-20µm) J-STD-005 powder distribution. Solder powder distribution is measured utilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder manufacturing processes ensures the particles shape are 95% spherical minimum (aspect ratio 1.5) and that the alloy contains a typical maximum oxide level of 80 ppm Metal Loading Typical metal loading for dispensing application is %. Page 3 of 6 SN/AG/CU. 862 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN/AG/CU. 862 Rev Printing of Solder Paste Dispensing Needle inner diameter Applicable powder Needle Gauge in. µm (mesh cut) The clearance gap between the needle and the substrate affects the shape and quality of the dot dispensed. If the clearance is too little, the dot tends to be flattened out, and if too large, the dot tends to have long tailing. Pressure The pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept in the range of lb/in 2 ( kg/cm 2 ). In cases where a paste requires much higher pressure (more than 40 lb/in 2 or 2.82 kg/ cm 2 ) to dispense, the paste will become inconsistent and clogging may be expected. The external air pressure supply should be maintained constant. Open & Abandon Time Tests have proven that DSP 615D without paste drying out. If extended downtime is expected ( 4 hrs), the whole dispensing sysem should be flushed without leaving any paste in any part of the system. Paste Application Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a dispensing application depends on viscosity, which cn be altered by temperature change. If solder paste is supplied in syringes pre-mixing is not necessary due to the shear action produced from the dispensing. Page 4 of 6 Reflow Best results have been acheived when DSP 615D is reflowed in a forced air convection oven with a minimum of 8 zones (top & bottom), however, reflow is possible with a 4 zone oven (top & bottom). The following is a recommended profile for a forced air convection reflow process. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e. density, thickness, etc.) determine the actual reflow profile P e a k T e m p M in \ C M a x \ C ) (C p m e T 2.5 C /s e c m in S lo p e 0.5 C /s e c P r e h e a t S o a k S o a k te m p \ C s R e flo w T im e = S e c T im e (S e c ) Preheat Zone- The preheat zone, is also referred to as the ramp zone, and is used to elevate the temperature of the PCB to the desired soak temperature. In the preheat zone the temperature of the PCB is constantly rising, at a rate that should not exceed 2.5 C/sec. The oven s preheat zone should normally occupy 25-33% of the total heated tunnel length. The Soak Zone- normally occupies 33-50% of the total heated tunnel length exposes the PCB to a relatively steady temperature that will allow the components of different mass to be uniform in temperature. The soak zone also allows the flux to concentrate and the volatiles to escape from the paste. The Reflow Zone- or spike zone is to elevate the temperature of the PCB assembly from the activation temperature to the recommended peak temperature. The activation temperature is always somewhat below the melting point of the alloy, while the peak temperature is always above the melting point. Flux Residues & Cleaning DSP 615D is a no clean formulation, therefore, the residues do not need to be removed for typical applications. If residue removal is desired, the use of Everkleen 1005 Buffered Saponifier with a 5-15% concentration in hot 60 C (140 F) will aid in residue removal. Page 5 of 6 Storage & Shelf Life It is recommended that solder paste be stored at a temperature of between F (2-10 C) to minimize solvent evaporation, flux separation, and chemical activity. If room temperature storage is necessary it should be maintain between F (20-25 C). Shelf Life Unopened Container (35-50 F/2-10 C) 6 months (from DOM) Unopened Container (68-77 F/20-25 C) 3 months (from DOM) Working Environment Solder paste performs best when used in a controlled environment. Maintaining ambient temperature between F (20-25 C) at a relative humidity of 40-65% will ensure consistent performance and maximum life of paste. Packaging 10cc 30cc 35 gm 100 gm Disposal DSP 615D should be stored in a sealed container and disposed of in accordance with state & local authority requirements. Page 6 of 6
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